Two component epoxy for structural bonding featuring superlative heat resistance; requires oven curing.
Two component epoxy for potting, encapsulation, coating and sealing applications
Two Component, Highly Flexiblized, Thermally Conductive, Electrically Insulating Epoxy Resin Compound for High Performance Bonding, Sealing, Coating and Encapsulation. Passes NASA Low Outgassing Test.
Toughened, Two Component Epoxy Adhesive/Sealant Featuring High Temperature and Chemical Resistance; Superior Thermal Cycling Capabilities.
One component, heat curing epoxy for structural bonding applications
One part, thermally conductive, electrically insulating, high performance epoxy for bonding and sealing; meets NASA low outgassing specifications
