EP19HTFL Product Information

EP19HTFL One Part Epoxy

One Component, Flexibilized Epoxy Resin System For Durable High Performance Adhesive/Sealants, Impregnants and Liners, with Good Storage Stability

EP21AN Product Information

EP21AN Two Part Epoxy System

Two Component, Room Temperature Curing Epoxy Adhesive, Sealant & Coating Featuring a Convenient One to One Mix Ratio, Exceptionally High Thermal Conductivity and Excellent Electrical Insulation Properties.

EP21ANHT Product Information

EP21ANHT Two Part Epoxy Compound

Two Component, Room Temperature Curing Epoxy Adhesive, Sealant and Coating Featuring Exceptional Thermal Conductivity, Excellent Electrical Insulation Properties and High Temperature Resistance.

EP21AOHT Product Information

EP21AOHT Two Part Epoxy Adhesive

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy Adhesive, Sealant and Coating Featuring a 1:1 Mix Ratio and High Temperature Resistance Up To 400°F

EP21AOLV-1 Product Information

EP21AOLV-1 Two Part Epoxy

Two Part, Room Temperature Curing Epoxy System Offers Thermal Conductivity and Electrical Insulation for Potting & Encapsulation as well as Bonding, Sealing and Coating; Has a Forgiving One to One Mix Ratio.

EP21AR Product Information

EP21AR Two Component Epoxy System

Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Acids.

EP21ARHT Product Information

EP21ARHT Two Part Epoxy

Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Acids Along with Higher Temperature Resistance.

EP21DP11 Red Product Description

EP21DP11 Two Part Epoxy

Low Viscosity, Two Component Epoxy For High Performance, Bonding, Sealing, Coating and Potting Applications. Featuring Excellent Flexibility and Thermal Cycling Capabilities. Red Color.

EP21HT Product Information

EP21HT Two Part Epoxy System

Two Component, Room Temperature Curing Adhesive, Sealant & Coating Featuring Convenient 1:1 Mix Ratio and High Temperature Serviceability Up To 400°F Conforms Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications

EP21LV Product Information

EP21LV Two Component Low Viscosity Epoxy System

Versatile Two Component, Low Viscosity Epoxy System For High Performance Bonding, Sealing, Coating, Encapsulation and Casting.

Conforms to FDA Chapter 1, Section 175.105 for Indirect Food Applications.

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