EP21TCHT-1 Product Information

EP21TCHT-1 Two Part Epoxy Adhesive

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating, and Heat Resistant Epoxy Compound for High Performance Bonding and Sealing. Serviceable from 4K to 400°F. Meets NASA Low Outgassing.

EP21TDC Product Information

EP21TDC Two Component Epoxy

Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance

EP21TDC-2 Product Information

EP21TDC-2 Two Part Epoxy

Two Component Epoxy System with Outstanding Flexibility and Peel Strength for High Performance Bonding, Sealing, Coating and Encapsulation. Serviceable at Cryogenic Temperatures.

EP21TDC-2AN Product Information

EP21TDC-2AN Two Part Epoxy

Two Component, Flexibilized, Highly Thermally Conductive, Electrically Insulating Epoxy Resin Compound for High Performance Bonding, Sealing, Coating and Encapsulation.

EP21TDC-2AO Product Information

EP21TDC-2AO Two Part Epoxy

Two Component, Highly Flexibilized, Thermally Conductive, Electrically Insulating Epoxy Resin Compound for High Performance Bonding, Sealing, Coating and Encapsulation.

EP21TDC-2LO Product Information

EP21TDC-2LO Two Part Epoxy

Two Component, Highly Flexiblized, Thermally Conductive, Electrically Insulating Epoxy Resin Compound for High Performance Bonding, Sealing, Coating and Encapsulation. Passes NASA Low Outgassing Test.

EP21TDC-4 Product Information

EP21TDC-4 Two Component Epoxy

Two Component, Highly Flexible Epoxy for High Performance Bonding, Sealing and Coating, Features Outstanding Adhesion to Rubbers and Other Substrates, Long Working Life and Higher Viscosity.

EP21TDCANHT Product Information

EP21TDCANHT Two Part Epoxy System

Two Component Thermally Conductive, Electrically Insulative Epoxy Adhesive Flexibilized For High Performance Bonding Featuring Exceptionally High Thermal Conductive

EP21TDCHT Product Information

EP21TDCHT Two Part Epoxy

Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance.

EP21TDCHT-1 Product Information

Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance

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