EP21TDCHT-LO Product Information

EP21TDCHT-LO Two Component Epoxy Adhesive

Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance. Cryogenically Serviceable. Meets NASA Low Outgassing Specifications.

EP21TDCN Product Information

EP21TDCN Two Part Epoixy System

Two Component Nickel Conductive Epoxy Adhesive for High Performance Bonding Featuring High Peel Strength, Superior Toughness and Low Volume Resistivity

EP21TDCNFL Product Information

Two Component Nickel Conductive Epoxy for High Performance Bonding and Sealing Featuring Convenient Handling, Good Electrical Conductivity and High Flexibility.

EP21TDCS Product Information

EP21TDCS Two Part Epoxy

Two Component Silver Conductive Epoxy for High Performance Bonding and Sealing Featuring High Peel Strength, Superior Toughness and Exceptionally Low Volume Resistivity.

EP21TDCS-LO Product Information

EP21TDCS-LO Two Part Adhesive System

Two Component Silver Conductive Epoxy for High Performance Bonding and Sealing Featuring High Peel Strength, Superior Toughness and Exceptionally Low Volume Resistivity. Passes ASTM 595 for NASA Low Outgassing

EP21TDCSFL Product Information

EP21TDCSFL Two Part Conductive Epoxy

Two Component Silver Conductive Epoxy for High Performance Bonding and Sealing Featuring Convenient Handling, Exceptional Low Volume Resistivity and High Flexibility.

EP21TDCSMed Product Information

EP21TDCSMed Two Part Medical Grade Epoxy

High Performance, Two Component, Silver Conductive Epoxy Adhesive/Sealant Featuring High Peel Strength, Superior Toughness and Exceptionally Low Volume Resistivity. Meets USP Class VI Specifications for Medical Applications

EP29LP Product Information

EP29LP Two Component Epoxy

Two Component, Very Low Viscosity, Room Temperature Curing Epoxy for Bonding, Sealing, Potting and Filament Winding with Exceptionally Low Exotherm and Long Working Life.

EP29LPSP Product Information

EP29LPSP Two Part Epoxy

Two Component, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing and Coating Formulated for Service at Cryogenic Temperatures and Capable of Withstanding Cryogenic Shock. Meets NASA Low Outgassing Requirements. Optically Clear.

EP29LPSPAO Product Information

EP29LPSPAO Two Part Epoxy

Two Component, Thermally Conductive, Electrically Insulative, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing, Coating, Potting and Encapsulation. Cryogenically Serviceable and Capable of Withstanding Cryogenic Shock.

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