UV15DC80-1 Product Information

One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.

EP4G-80Med Product Description

One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Meets ISO 10993-5 for cytotoxicity. Graphite filled. Thermally conductive, electrically conductive, high compressive strength.

MasterSil 323 Product Information

Two Component, Addition Cured Silicone for bonding, sealing, and encapsulating. Featuring optical clarity and excellent strength properties.

EP41S-5Med Product Information

Two Part Epoxy EP41S-5Med

Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Solvents, Alcohols and Fuels.

EP4CL-80Med Product Description

One Part Epoxy EP4CL-80Med

One component, optically clear epoxy for bonding and sealing that cures at 80°C to 85°C. Ultra low viscosity. Meets ISO 10993-5

EP4CL-80 Product Description

One component, optically clear epoxy for bonding and sealing that cures at 80°C to 85°C. Ultra low viscosity. May be utilized for impregnation applications and spin coating.

EP62-1LPSPMed White Product Information

Two Part Epoxy EP62-1LPSPMed White

Two component, high performance epoxy system featuring biocompatibility for bonding, sealing, coating, encapsulating and impregnation

EP40TCMed Product Information

Two Component Epoxy EP40TCMed

Two Component, thermally conductive, electrically insulative epoxy system for medical device applications. ISO 10993-5 certified.

EP62-1HTMed Product Information

Two Component Epoxy EP62-1HTMed

Two Component Epoxy System Features a Very Long Pot Life at Ambient Temperatures Combined with Rapid Cures and Sterilization Resistance, Passes 10993-5 for Cytotoxicity

EP4S-80 Product Description

One Part, Silver Filled Epoxy

One component epoxy for bonding, sealing and coating applications, curing temperature 80°C. Electrically conductive, NASA low outgassing.

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