Two Component, Room Temperature Curing High Temperature Resistant Epoxy Adhesive/Sealant For Service from -112°F to +400°F Featuring High Peel and High Shear Strength
Two Component, Room Temperature Curing, High Temperature Resistant Epoxy Adhesive/Sealant for Service from -112°F to +400°F Featuring High Peel and High Shear Strength. Meets NASA Low Outgassing Specifications.
One Component, Heat Curing Epoxy Adhesive, Sealant Featuring Both High Shear and High Peel Strength for Optimal Bonding Performance and Exceptionally High Thermal Conductivity
One Component, Heat Curing Epoxy Adhesive, Sealant Featuring Both High Shear and High Peel Strength for Optimal Bonding Performance and Exceptionally High Thermal Conductivity
One Component, Fast Curing, Toughened Epoxy for Bonding, Sealing and Coating Featuring Excellent Thermal Conductivity and Very Good Electrical Insulation Properties. Can Withstand Rigorous Thermal Cycling.
One Component, Toughened Epoxy Adhesive, Sealant and Coating Featuring High Shear and High Peel Strengths. Uniquely Special System Cures at 175°F with Superior Adhesive Properties and Outstanding Thermal Cycling Capabilities.
One Component, High Performance Epoxy System Featuring Fast Curing. Ideal for Glob Top Applications as well as Bonding and Sealing; Formulated to Withstand Thermal Cycling and Shock.
Two Component Fast Curing Heat Resistant Toughened Epoxy Adhesive Featuring High Shear Strength, Superior Dimensional Stability, Good Chemical Resistance, Excellent Impact and Shock Resistance for Superior Bonding
