One Component, Low Viscosity UV Curable System for High Performance Bonding, Sealing & Coating, Featuring Excellent Physical Properties and Dimensional Stability.
Highly Versatile, Low Viscosity, Two Component Epoxy System for High Performance Bonding, Coating, Sealing and Casting; Featuring Superb Optical Clarity.
One Component, Nanosilica Filled UV Curable Epoxy System with Superb Optical Clarity, Abrasion Resistance and Dimensional Stability for Bonding, Sealing, Coating and Encapsulation. Exceptionally Low Shrinkage.
Two Component, Thermally Conductive Room Temperature Curable, Heat Resistant Epoxy Adhesive, Sealant, Coating & Casting System with Excellent Chemical Resistance and Electrical Insulation Properties. Ideal for Potting & Encapsulation Applications.
Two Component, Low Viscosity, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Encapsulating Featuring Very Low Coefficient of Expansion, Excellent Dimensional Stability and Low Shrinkage Upon Cure.