Two Component, Addition Cured Silicone for High Performance Bonding and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Paste Consistency; Self Priming System. Meets ISO 10993-5 Specifications.
One Component, Room Temperature Curing, Silicone Elastomer System for High Performance Bonding and Sealing; Featuring Flowable, Non-Corrosive Cure and Serviceability Up to 300°C; Unsurpassed Stability at Elevated Temperatures.
Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating and Encapsulation Featuring Outstanding Physical Properties, Commanding Dimensional Stability, Low Shrinkage Upon Curing and Easy Processing.
Two Component, Room Temperature Curing, Passes ISO 10993-5. Thermally Conductive, Electrically Isolating Epoxy for Bonding and Sealing Featuring High Temperature Resistance along with High Shear and Peel Strength.
One Component, Low Viscosity UV Curable Polymer System for High Performance Bonding, Sealing, Coating and Encapsulation, Featuring Excellent Physical Strength Properties and Low Shrinkage Upon Cure.
Flexibilized, Two Component, Room Temperature Curing, Urethane-Modified Epoxy System Featuring Superior Toughness, and Abrasion Resistance for High Performance Bonding, Sealing, Coating and Encapsulation
