EP26 Product Description

Fast Curing Mineral Filled Two Component Epoxy Adhesive For High Performance Bonding And Sealing With Enhanced Dimensional Stability

EP29LP Product Information

EP29LP Two Component Epoxy

Two Component, Very Low Viscosity, Room Temperature Curing Epoxy for Bonding, Sealing, Potting and Filament Winding with Exceptionally Low Exotherm and Long Working Life.

EP29LP-1 Product Description

EP29LP-1 Two Component Epoxy

Two Component Low Viscosity, Room Temperature Curing Epoxy System Featuring Exceptionally Long Working Life and Low Exotherm for Bonding, Sealing, Casting and Filament Winding

EP29LPCC Product Description

Two Component Low Viscosity, Room Temperature Curing Epoxy System Featuring Color Change Upon Curing for Bonding, Coating, Sealing and Encapsulation.

EP3 Product Description

EP3 One Part Epoxy

One Component Heat Curing Epoxy Adhesive Featuring Both High Shear and High Cure Speed for Optimal Bonding Performance

EP30-2 Product Information

EP30-2 Two Part Epoxy Compound

Versatile Lower Viscosity, Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation; Features Superior Optical Clarity; Cryogenically Serviceable. Meets NASA Low Outgassing Specifications.

EP30-2SP Product Description

Low Viscosity, Two Component Epoxy Resin System For High Performance Bonding, Laminating and Sealings

EP30AN Product Information

EP30AN Two Part Epoxy

Two Component, Room Temperature Curing Epoxy for Potting, Bonding, Sealing and Coating with Unsurpassed Thermal Conductivity and Superb Electrical Insulation; Features Low Viscosity and Excellent Thermal Transfer Properties.

EP30AN-1 Product Information

EP30AN-1 Two Part Epoxy

Two Component, Room Temperature Curing, Low Viscosity Epoxy for Potting, Sealing, Coating and Bonding Featuring Exceptionally High Thermally Conductivity and Excellent Electrical Insulation Properties. Now NASA Approved for Low Outgassing Applications

EP30AO Product Information

EP30AO Two Part Epoxy Resin System

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy for Potting, Bonding, Sealing & Coating. Features Low Viscosity & Excellent Thermal Transfer Properties.

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