Thermally Conductive

Two Component, Thermally Conductive, Room Temperature Curable, Heat Resistant Epoxy Adhesive, Sealant, Coating & Casting System with Excellent Chemical Resistance and Electrical Insulation Properties. Ideal for Potting & Encapsulation Applications. Passes NASA low outgassing. Cryogenically Serviceable.

Two Component Electrically Conductive Heat Resistant Epoxy Compound for High Performance Structural Bonding, and Casting

Two Component, Thermally Conductive, Electrically Insulating Epoxy for High Performance Bonding, Sealing and Encapsulation. Features a Glass Transition Temperature in Excess of 200°C; Requires Elevated Temperature Curing at 250°F or Above. Meets NASA Low Outgassing.

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy Adhesive, Sealant and Coating Featuring a Convenient One To One Mix Ratio and Fast Cure.