6 Master Bond Epoxy Adhesives Tested and Approved for MIL-STD-883J for Thermal Stability

Product:
EP21TDCHT

Release Date:
03/12/2018

Master Bond is pleased to announce that the following epoxy compounds, EP17HTDA-1, EP21TDCHT, EP33, EP46HT-1AO, Supreme 11AOHT and Supreme 12AOHT-LO have passed MIL-STD-883J section 3.5.2., the subsection of the United States Military Standards set by the U.S. Department of Defense that refers to the thermal stability of a material. This test indicates a consistent product performance for temperatures up to 200°C.

MIL-STD-883 section 3.8.5 defines that thermal stability testing should be done by performing a thermogravitmetric analysis (TGA) according to ASTM D3850. TGA is the study of a material’s weight change as a function of temperature and time under a controlled atmosphere. It can be used to determine the thermal stability of a material.

To evaluate the material, samples are placed in a nitrogen atmosphere (20-30mL/min flow). The measurement of the samples start at room temperature (25°C) and then continues as the samples get heated 10°C/min up to a final temperature of 200°C. During this assessment, the weight of the samples is continuously measured. A material passes this standard if the weight loss at 200°C is less than or equal to 1.0 percent of the cured material weight. Three samples are tested and the average value of the three must meet or exceed the minimum requirements.

To date, Master Bond has sent 6 epoxy adhesives for this test through an independent lab. All six have passed the MIL-STD-883J, Method 5011 (sect. 3.5.2 & 3.8.5), tested in accordance with ASTM D3850.

For a full product description for each of the six products tested, please visit the following pages: