Master Bond Product Search

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EP19HTLV-2 One Part Epoxy System EP19HTLV-2

Viscosity 200-700 cps. One part system has "unlimited" working life at room temperature. Impressive physical strength properties. Sprayable or brushable. Chemical resistant. Excellent thermal stability. Serviceable from -60°F to +400°F.

EP3 One Part Epoxy EP3

One component heat curable epoxy adhesive. Fast cure speeds. Resists vibration, impact, stress fatigue cracking, creep corrosion. Gray color. Adhesive spreads evenly and smoothly. Serviceable from -100°F to +300°F.

EP36 One Part B-Stage Epoxy EP36

One part B-staged epoxy. Flexibilized and toughened. Withstands rigorous thermal cycling and thermal shocks. Superb electrical insulation properties. Ideal for potting/encapsulation. Serviceable from -100°F to +500°F. Available in 30 gram cookies.

EP36AN One Component, B-stage Epoxy EP36AN

Thermally conductive/electrically insulative B-stage epoxy potting/bonding compound. Outstanding toughness and flexibility. Resists up to 500°F. Ability to withstand thermal cycling and impact/vibration. Shore D hardness 80. Volume resistivity 1014 ohm-cm.

EP36AO One Component B-stage Epoxy EP36AO

Thermally conductive, electrically insulative B-stage toughened epoxy. One part system. Ideal for potting and encapsulation. Capable of withstanding rigorous thermal shocks. Serviceable from -100°F to +500°F. Available in 30 gram cookies. Meets NASA low outgassing specifications.

EP36CLV One Part Epoxy Compound EP36CLV

One component, B-staged epoxy. Features low viscosity and excellent electrical insulation properties. Operating service temperature range -100°F to +500°F. Combines flexibility and toughness. Superior chemical resistance to water, acids, bases, fuels and oils. Elongatio >50%.

EP36FR One Component Epoxy EP36FR

Flame retardant B-stage toughened epoxy. One part system. Ideal for potting and encapsulation. Capable of withstanding rigorous thermal shocks. Serviceable from -100°F to +500°F. Available in 30 gram cookies.

EP3ANHT One Part Epoxy EP3ANHT

Heat resistant thermal conductive epoxy for potting and bonding. No mix system. 100% reactive. Thermal conductivity 23 BTU in/ft2/hr/°F. Gel time 90-100 seconds at 150°C. Volume resistivit <1015 ohm-cm. Offers protection against abrasion and thermal cycling. Serviceable from -60°F to +400°F.

EP3AOHT One Part Epoxy EP3AOHT

Light paste. One component, no mix system. Thermally conductive/electrically insulative. Service temperature range -60°F to +400°F. Flexible cure schedules. Cost effective.

EP3AOHTLV One Component Epoxy EP3AOHTLV

Single component thermally conductive/electrically insulative epoxy for bonding/potting. Heat resistant. Fast curing. Offers excellent adhesion to metallic and nonmetallic substrates. Serviceable from -60°F to +400°F.

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