Expanded Product List
Master Bond Product Search
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EP21TDC-4 Two part, room temperature curing epoxy with outstanding flexibility and superb adhesion to many rubbers and metals. Excellent thermal cycling properties. Ability to withstand mechanical shock and vibration. T-peel strength 25-35 pli. Elongatio >200%. Water and chemical resistant. Operating temperature range -100°F to +250°F. |
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EP21TDC-4HT Toughened epoxy compound for high performance bonding, sealing, casting. Serviceable from -65°F to +400°F. Cures at ambient temperatures. Excellent electrical insulative characteristics. Compound flows readily. Bonds well to untreated rubbers such as neoprene, nitrile SBR and EPDM. Superior shear and peel strength properties. |
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EP21TDC-4ND Smooth paste epoxy adhesive. High flexibility. Elongatio >200%. Impressive resistance to mechanical vibration and shock. Outstanding adhesion to rubbers such as SBR, nitrile, neoprene. T-peel strength >30 pli. Serviceable from -100°F to +250°F. |
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EP21TDC-7 High peel strength, room temperature curing epoxy. Has an elongation over 300%. Low temperature serviceability. Adheres well t natural rubber, neoprene, nitrile, SBR without surface preparation. Serviceable from -100°F to +250°F. Excellent resistance to thermal shock. T-peel strength > 40 pli. Can cure underwater. |
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EP21TDCANHT Features exceptional thermal conductivity. High dielectric strength. Idea for joining dissimilar substrates. Serviceable from -100°F to +400°F. Superior durability. Will cure at room temperature. |
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EP21TDCAOHT Flexibilized two component epoxy offers thermal conductivity/electrical insulative properties. High peel/shear strength formulation. Paste viscosity. Will not drip on vertical surfaces. Bonds well to dissimilar substrates. Serviceable from -100°F to +350°F. |
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EP21TDCF-3NV Rapid, room temperature curing, toughened epoxy adhesive. 100% reactive system. High peel and shear strength properites. Superior thermal cycling capabilities. Thixotropic paste. Gap filling. Chemically resistant. Non-critical one to one mix ratio by weight or volume. Resistant to vibration and shock.Serviceable from -410°F to +250°F. |
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EP21TDCF1 High peel/shear strength epoxy adhesive. Short fixture time. Fast room temperature cures. Excellent toughness. Superior thermal cycling capabilities. Adheres well to similar/dissimilar substrates. Thixotropic paste. Gray color. Serviceable from -100°F to +250°F. |
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EP21TDCHT High strength, high temperature resistant, two part system with excellent bond strength and thermal cycling capabilities. Serviceable from -100°F to +350°F. Meets MIL-STD-883J Section 3.5.2 for thermal stability. Moderate viscosity. Superior toughness. Withstands vibration, impact, shock. Good dimensional stability. Convenient one to one mix ratio. Dependable electrical insulation properties. |
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EP21TDCHT-1 Flexibilized two component epoxy adhesive. Cures at room temperature or more rapidly at elevated temperatures. Forgiving one to one mix ratio. Ideal for bonding substrates with CTE mismatches. Superior chemical resistance. Durable. Service operating temperature range from -100°F to +400°F. |