Expanded Product List
Master Bond Product Search
550 products match
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EP30-2LB Optically clear epoxy that blocks UV light from 200 nm to about 400 nm. Transmits well from 450-900 nm and above. Structural adhesive. Passes NASA low outgassing tests. Electrical insulator. Cures at room temperature. Epoxy flows smoothly. Dimensionally stable. Low shrinkage upon cure. Serviceable from -80°F to +300°F. |
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EP30-3 Heat curable, optically clear epoxy. Serviceable from -80°F to 450°F. Excellent dimensional stability. T >325°F. Shore D hardnes >75. Outstanding dielectric strength. First rate chemical resistance. Low viscosity. Long working life. Easy to apply. |
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EP30-3LO Superb optical clarity. Serviceable from -80°F to +450°F. T >175°C. Low viscosity and long working life. Superior dielectric properties. NASA low outgassing approved. Withstands 1,000 hours 85°C/85% RH. |
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EP30-4 Rapid room temperature curing two component epoxy system. Low viscosity. Optically clear and non-yellowing. Superior chemical resistance. Superb electrical insulation properties. Cures quickly even in thin sections. High bond strength. Two to one mix ratio by weight. Low shrinkage. Shore D hardnes >80. Serviceable from -60°F to +250°F. |
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EP30-4Med Rapid room temperature curing two component epoxy system. Low viscosity. Optically clear and non-yellowing. Superior chemical resistance. Superb electrical insulation properties. Cures quickly even in thin sections. High bond strength. Two to one mix ratio by weight. Low shrinkage. Shore D hardnes >80. Serviceable from -60°F to +250°F. |
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EP30AN Epoxy features superior heat transfer properties. High impact strength. Abrasion resistant. Low CTE. Excellent flowability. Ideal for potting and encapsulation. Serviceable from -60°F to +250°F. |
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EP30AN-1 Thermal conductive/electrically insulative epoxy cures at room temperature. Outstanding heat dissipative properties. Serviceable from -60°F to +250°F. Low viscosity. Suitable for potting/encapsulation. NASA approved for low outgassing. |
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EP30AN-1LP Exceptionally high thermal conductivity. Superb electrical insulation properties. Versatile cure schedule. Excellent flowability. Long working life. Rigid bonds. Impressive compressive strength. Serviceable from -60°F to +250°F. |
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EP30ANHT Epoxy bonding, sealing, coating compound. Outstanding thermal conductivity and electrical insulative properties. Low CTE. Good flowability. Ideal for potting/encapsulation. Serviceable from -60°F to +450°F. |
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EP30AO Low viscosity, thermally conductive potting, bonding and sealing compound. Cures at room temperature. Superior electrical insulation properties. High compressive strength. Rigid bonds. Low thermal expansion coefficient. Excellent dimensional stability. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +250°F. |