Expanded Product List
Master Bond Product Search
550 products match
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EP13LTE One component, heat curable epoxy adhesive. Serviceable from -60°F to +500°F. Paste viscosity. High tensile shear and compressive strength. Chemical resistant. Machinable. Low coefficient of thermal expansion. Meets NASA low outgassing standards. |
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EP13SPND-2 Non-drip single component adhesive. Will not flow when cured. Serviceable up to +500°F. Electrically insulative. Withstands 1000 hours 85°C/85%RH. Excellent bond strength properties. |
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EP17HT Serviceable up to 600°F. Exceptional Tg of 220-225°C. No mix formulation. Low exotherm upon curing. Exemplary chemical resistance. Can be used in encapsulations and castings beyond 1/2 inch thickness. |
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EP17HT-100 High performance one part epoxy. Good flow properties. Thermally conductive, electrically insulative. Service temperature range -100°F to +500°F. Can be cast in thicknesses up to 1/2 inch. High dimensional stability. |
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EP17HT-3 One part snap cure epoxy. Cures in 2-3 minutes at 250-300°F. Service operating temperature range -60°F to +400°F. Ideal for bonding dissimilar substrates and applications subject to thermal cycling. Outstanding electrical insulation properties. Withstands 1000 hours at 85°C/85%RH. |
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EP17HT-LO One part, no mix epoxy meets NASA low outgassing specifications. Serviceable up to 600°F. Tg is 225°C. High shear, tensile and compressive strength properties. Cures in 90-120 minutes at 300F. Withstands 1000 hours 85°C/85% RH. |
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EP17HTDA-1 Single component heat curable epoxy adhesive/sealant. Non-drip system. Resists up to 525°F. Meets NASA low outgassing specifications. Meets MIL-STD-883J Section 3.5.2 for thermal stability. High lap shear, tensile and compressive strength. Tg of 230-240°C after post cure. |
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EP17HTDA-2 One component, heat cured epoxy for bonding and sealing, as well as die attach applications. Flowable, high viscosity system, cures in 4-5 hours at 300°F or 3-4 hours at 350°F. Post cure to optimize properties. High glass transition temperature. NASA low outgassing approved. |
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EP17HTDM-2 Black One component, heat cured epoxy for bonding and sealing, as well as die attach applications. Flowable, high viscosity system, cures in 4-6 hours at 300°F or 2-3 hours at 350°F. Post curing at 400°F for 1-2 hours to optimize properties. Limited flow and low exotherm when curing. |
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EP17HTND-2 Single component heat curable epoxy epoxy adhesive/sealant. Non-drip system. Resists up to 600°F. Meets NASA low outgassing specifications. High lap shear, tensile and compressive strength. Tg of 230-240°C after post cure. |