Expanded Product List
Master Bond Product Search
550 products match
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EP39MHT Low viscosity potting/encapsulation compound. Superior dielectric properties. Versatile cure schedules. Convenient one to one mix ratio weight or volume. Minimal shrinkage and stress development. Resists thermal cycling and mechanical shocks. Successfully tested for 1,000 hours 85°C/85% RH. Service temperature range -100°F to +400°F. |
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EP3ANHT Heat resistant thermal conductive epoxy for potting and bonding. No mix system. 100% reactive. Thermal conductivity 23 BTU in/ft2/hr/°F. Gel time 90-100 seconds at 150°C. Volume resistivit <1015 ohm-cm. Offers protection against abrasion and thermal cycling. Serviceable from -60°F to +400°F. |
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EP3AOHT Light paste. One component, no mix system. Thermally conductive/electrically insulative. Service temperature range -60°F to +400°F. Flexible cure schedules. Cost effective. |
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EP3AOHTLV Single component thermally conductive/electrically insulative epoxy for bonding/potting. Heat resistant. Fast curing. Offers excellent adhesion to metallic and nonmetallic substrates. Serviceable from -60°F to +400°F. |
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EP3FL Flexibilized one part epoxy system. Withstands severe environmental conditions in service. 100% reactive. Brown/yellow color. Resists thermal and mechanical stresses. Low shrinkage. Serviceable from -100°F to +250°F. |
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EP3HT Fast, one component heat curable adhesive. Serviceable from -60°F to +400°F. High shear strength properties. Shore D hardnes >70. "Unlimited" working life at room temperature. Superb electrical insulator. Withstands 1,000 hours 85°C/85% RH. |
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EP3HT-LO Rapid curing, one part epoxy. Meets NASA low outgassing standards. Moderate viscosity. High shear strength. Serviceable from -60°F to +400°F. Withstands 1,000 hours 85°C/85% RH. |
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EP3HTFL Heat resistant, flexibilized one component epoxy resin system. Superior physical strength properties. Inert to water and chemicals. Provides protection against rigorous thermal cycling and mechanical stress. Serviceable from -60°C to +175°C. |
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EP3HTMed Rapid curing, one part epoxy. Meets USP Class VI biocompatibility standards. Thixotropic paste viscosity. High shear strength. Superb resistance to autoclaving, chemical sterilants, radition, EtO. Serviceable from -60°F to +400°F. |
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EP3HTND-2Med Black Rapid curing, one part epoxy. Meets USP Class VI biocompatibility standards. Non-drip, paste viscosity. High shear strength. Superb resistance to autoclaving, chemical sterilants, radition, EtO. Serviceable from -60°F to +400°F. |