Expanded Product List
Master Bond Product Search
550 products match
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EP42HT-2ND-2Med Black Two component epoxy paste adhesive. Resists sterilization exposure. USP Class VI approved. Outstanding thermal stability and electrical insulation properties. Cures at ambient temperatures. Withstands multiple cycles of autoclaving, radiation, EtO and chemical sterilants. Post curing is recommended to optimize physical properties. Serviceable from -60°F to +450°F. |
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EP42HT-3AO Thermally conductive, electrically insulative. Ideal for potting and encapsulation. Castable up to 3-4 inches. Excellent chemical resistance. Enhanced thermal cycling capabilities. Good flow. Serviceable from -100°F to +400°F. Impervious to intermittent exposures to steam. Shore D hardnes >80. |
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EP42HT-4AOMed Black Thermally conductive, electrically insulative two part epoxy. Meets USP Class VI and ISO 10993-5 certifications. Cryogenically serviceable from 4K to +400F. NASA low outgassing aproved. Black in color. For bonding, sealing, coating and casting. |
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EP45AOHT Thermally conductive/eletrically insulative epoxy serviceable from -60°F to +500°F. Heat curing. Paste viscosity. Superior chemical resistance properties. Gap filling. Long pot life. Withstands thermal cycling. Gray color. |
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EP45HT High performance adhesive/sealant/coating. Serviceable from -80°F to +500°F. Resists thermal cycling. Outstanding resistance to acids, bases, petrochemicals, water. 100% reactive. Cures at elevated temperatures. Good flow properties. Moderate viscosity. Excellent performance profile for long term exposures at 400°F to 450°F. Well suited for moderate sized electronic potting applications. |
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EP45HTMed USP Class VI certified. Withstands repeated cycles of sterilization such as autoclaving, radiation and chemical sterilants. High bond strength. Heat curing. Two component epoxy system. Long pot life. Service operating temperature range from -80°F to +500°F. |
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EP45HTN Electrically conductive heat resistant epoxy compound. Volume resistivity 5-10 ohm-cm. Service operating temperature range from -80°F to +500°F. Paste viscosity. High tensile and compressive strength properties. Cures at elevated temperatures. 100% reactive. Long pot life. |
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EP45HTND-2 Non-drip epoxy adhesive resists elevated temperature. Paste consistency. Heat curable. Will not flow when curing. Serviceable from -80°F to +500°F. Withstands aggressive chemical exposure. Gap filling. High tensile lap shear and tensile modulus strength. Top notch electrical insulator. |
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EP45HTQ Quartz filled heat resistant epoxy system. Two component structural adhesive. Durable. High compressive strength. Requires elevated temperature cure. Long pot life. Can be applied on vertical surfaces without dripping. Serviceable from -60°F to +500°F. |
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EP46CA Oven curing. Two component epoxy for bonding/sealing. Long pot life. Serviceable from -100°F to +600°F. T > 240°C. High bond strength. Outstanding electrical insulation properties. Robust chemical resistance. |