Expanded Product List
Master Bond Product Search
550 products match
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EP21AO Room temperature curing thermally conductive/electrically insulative epoxy adhesive. Convenient one to one mix ratio, weight or volume. High bond strength. Adheres well to metals, composite, ceramics, glass, rubbers and most plastics. Superb dimensional stability. Serviceable from -60°F to +250°F. |
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EP21AOHT Two component epoxy adhesive features thermal stability and heat dissipation properties. Superb electrical insulator. High compressive strength. Excellent dimensional stability. Resists -60°F to +400°F. Non-critical one to one mix ratio by weight or volume. Gap filling system. |
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EP21AOHTLV Low viscosity two component thermally conductive/electrically insulative epoxy. Resists -60°F to +400°F. Bonds withstand exposure to thermal cycling and chemicals. Can be used as potting compound. Cures at room temperature or more rapidly at elevated temperatures. |
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EP21AOLV Excellent thermal conductivity/electrical insulation properties. Flows nicely. Easy application for bonding and potting. Serviceable from -60°F to +400°F. Cures at room temperatures. High compressive strength. Convenient one to one mix ratio by weight or volume. |
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EP21AOLV-1 Excellent thermal conductivity/electrical insulation properties. Flows nicely. Easy application for bonding and potting. Serviceable from -60°F to +400°F. Cures at room temperatures. High compressive strength. Convenient one to one mix ratio by weight or volume. |
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EP21AOLV-2LO Two part, ambient temperature curing epoxy potting/encapsulation compound. Thermally conductive/electrically isolating. Very low exotherm. Suitable for large castings. Meets NASA low outgassing specifications. Service operating temperature range from -60°F to +250°F. Withstands 1,000 hours 85°C/85% RH. |
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EP21AOLV-2Med Meets USP Class VI requirements and passes ISO 10993-5 tests for cytotoxicity. Smooth flowable consistency. Thermally conductive//electrically insulative. Can be used for bonding, sealing, coating, encapsulation. One to one mix ratio. Cures at room temperature. Resists EtO, radiation, and chemical sterilants. Serviceable from -60°F to +250°F. |
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EP21AOND Two component non-drip epoxy adhesive. Thermal conductive/electrically insulative. Versatile cure schedules. High bond strength to similar and dissimilar substrates. Serviceable from -60°F to +250°F. |
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EP21AR Two part, room temperature curable epoxy system with superior resistance to inorganic acids. Low viscosity. Used for bonding, sealing, coating, encapsulation. Serviceable from -60°F to +250°F. 100% reactive compound. Excellent dielectric strength. Especially noteworthy is its resistance to sulfuric and hydrochloric acids. |
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EP21ARHT Serviceable from +400°F. Exceptional acid resistance. Cures at room temperature. Good flow properties. 100% reactive. Low shrinkage upon cure. |