Expanded Product List
Master Bond Product Search
550 products match
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Supreme 3AO Low temperature curing thermal conductive epoxy adhesive. Outstanding toughness and durability. Dimensional stability. Easy application. Gray color. Serviceable from -100°F to +300°F. |
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Supreme 3AOHT One component, fast heat curing system. Can withstand rigorous thermal cycling. Thermally conductive, electrically insulative. Paste viscosity. Serviceable up to 350°F. |
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Supreme 3CCM-85 One part epoxy system designed for glob tops and small encapsulation. Curing temperature 175-185°F for 2 to 3 hours. Toughened epoxy can withstand thermal cycling. Suitable for bonding and potting. Thermally conductive and electrically insulative. Service temperature range from -100°F to +350°F. |
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Supreme 3DM-85 One part epoxy for bonding, sealing, and dam-and-fill applications, and chip on board encapsulations. Cures at 185°F. Reliable electrical insulator, Used as a barrier to block flow. Thermally conductive, electrically isolating, paste consistency. |
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Supreme 3HT One part, oven curing epoxy system with very good adhesion to a wide range of plastics. Especially well suited for bonding dissimilar plastic materials. Resists -100°F to +350°F. Exceptional toughness. Successfully tested for 1,000 hours at 85°C/85% RH. |
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Supreme 3HT-80 Fast cures at ambient 175°F (80°C). Recommended for bonding heat sensitive substrates. Outstanding thermal cycling capabilities. Single part no mix system. Serviceable from -100°F to +350°F. Tough and durable. Withstands 1,000 hours at 85°C/85% RH. |
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Supreme 3HTLV One part, lower viscosity, oven curing epoxy system with very good adhesion to a wide range of plastics. Especially well suited for bonding dissimilar plastic materials. Resists -100°F to +350°F. Exceptional toughness. |
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Supreme 3HTND-1SM One part, oven curing system (cures at 125-150°C) with rapid curing. Good physical properties. Paste consistency. Recommended for surface mounting. Void filling. Low ioinic impurities. Superior "green" strength. No stringing. Withstands thermal stress. Consistent dot profile. Can be automatically dispensed for high volume applications. Serviceable from -100°F to +350°F. |
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Supreme 3HTND-2CCM Toughened epoxy system for bonding, sealing, coating, encapsulation, glob topping. Requires no mixing. Rapid heat curing Passes NASA low outgassing testing. Transfers heat efficiently. Ideal rheology and flow for multiple applications. Stellar electrical insulation properties. Serviceable from -100°F to +400°F. |
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Supreme 3HTND-2DA One component, fast curing die attach adhesive. Excellent die shear strength. Serviceable from -100°F to +400°F. Low ionics. Superior thermal conductivity and electrical insulation properties. Dispenses smoothly without tailing or bleed out. Cures in 5-10 minutes at 150°C. NASA low outgassing approved. Available in syringes. Well suited for automatic dispensing. Performed well in 85°C/85% RH testing. |