550 products match
EP21ARHTND Non-drip paste. Exceptional chemical resistance to acids. High bond strength. 100 to 50 mix ratio by weight. Formulated to cure at ambient temperatures. Used for coating pumps, storage vessels, tanks. Serviceable from -60°F to +400°F. |
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EP21ARHTND-2 Non-drip paste. Exceptional chemical resistance to acids. High bond strength. 100 to 50 mix ratio by weight. Formulated to cure at ambient temperatures.Serviceable from -60°F to +400°F. |
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EP21ARLV Two part, room temperature curable epoxy system with superior resistance to inorganic acids. Low viscosity. Used for bonding, sealing, coating, encapsulation. Serviceable from -60°F to +250°F. 100% reactive compound. Excellent dielectric strength. Especially noteworthy is its resistance to sulfuric and hydrochloric acids. |
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EP21BAS Two component, room temperature curing, radiopaque epoxy adhesive, sealant and coating. Employed for medical diagnostic and therapeutic devices. Effective for even 100 KV, px-ray (peak x-ray) machines and higher energy capacities. Convenient one to one mix ratio. High bond strength. Superior electrical insulation properties. Serviceable from -60°F to +250°F. |
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EP21CLV Two component epoxy adhesive, sealant, coating, potting, casting compound. Convenient one to one mix ratio. Cures at ambient temperatures. Good flow characteristics. Adjustable rigidity and flexibility by altering mix ratio. Durable bonds for similar and dissimilar substrates. Serviceable from -65°F to +250°F. |
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EP21D3F2 High viscosity, two part epoxy that is opaque, with light white color. High optical opacity. Cures at room temperature or more rapidly with heat. Low linear shrinkage. Good physical strength properties. |
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EP21DP11 Red Flexible two component epoxy for bonding, sealing, casting, potting. Low viscosity. 100% reactive. Resistant to thermal cycling. Superb electrical insulator. Serviceable from -60°F to +250°F. Contains release agent that facilitates use in potting and encapsulation application. Shore D hardness 45-55. Red color. |
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EP21DP12 Flexible two component epoxy for bonding, sealing, casting, potting. Urethane modified epoxy, 100% reactive. Resistant to thermal cycling. Serviceable from -100°F to +250°F. Available in many colors. |
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EP21FL Toughened, two component epoxy system for bonding, sealing and potting. Excellent resistance to impact and exposures to many chemicals. Superior electrical insulation properties. Low exotherm upon cure. Long working life. Serviceable from -100°F to +250°F. Withstands 1,000 hours 85°C/85% RH. |
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EP21FLV Fast curing epoxy adhesive. Produces durable, tough, high strength bonds. Will cure at low ambient temperatures. Resistant to thermal cycling. Non critical equal weight or volume mix ratio. Excellent dielectric properties. Service operating temperature range from -60°F to +250°F. |