Master Bond Product Search

550 products match

UV18S One Part UV System UV18S

UV curable system with superior resistance to chemicals, particularly solvents. High bond strength. Excellent light transmission properties. Electrical insulator. Low shrinkage upon cure. Exceptionally fast curing. Serviceable from -60°F to 250°F.

 UV19 One Part UV Curable Compound UV19

Single component, optically clear UV curable compound. Particularly suited for laminating, bonding substrates with different thermal expansion coefficients, such as flexible soft plastic films to polyester films, metal foils. Elongatio >80%. High impact strength. Long term chemical resistance. Serviceable from -60°F to 250°F.

UV21 One Part UV Curable System UV21

Highly flexible UV curable urethane elastomer compound. Used for high performance seals, gaskets, bonding and protective coating applications. Fast curing at room temperature. Superior chemical resistance. Shore A hardness 45-55. Elongation over 260%. Viscosity 30,000-38,000 cps. Serviceable from -65°F to 250°F.

UV22 One Part UV Curable Epoxy UV22

UV curable, nanosilica filled system with excellent abrasion resistance. Easy to apply and fast room temperature curing upon exposure to UV light. Meets NASA low outgassing requirements. Excellent optical clarity. Superior dimensional stability. Withstands 1,000 hours 85°C/85% RH. Tg is 135°C after post curing for 30 minutes at 125-150°C. Serviceable from -80°F to +350°F.

UV22DC80-1 UV Curable System UV22DC80-1

Dual cure system with UV and heat curing mechanisms. Cures at 80°C in shadowed out areas. Nano filled, high dimensional stability and abrasion resistance. Bonds well to metals, glass, ceramics and most plastics. Serviceable from -60°F to +350°F.

UV22DC80-10F One Part UV System UV22DC80-10F

Dual cure system with UV and heat curing mechanisms. Fast cures at 80°C in shadowed out areas. Nano filled, high dimensional stability and abrasion resistance. Bonds well to metals, glass, ceramics and most plastics. Minimal shrinkage upon curing. Serviceable from -60°F to +350°F.

UV Dual Curing System UV22DC80-1Med UV22DC80-1Med

Dual cure system with UV and heat curing mechanisms. Cures at 80°C in shadowed out areas. Nano filled, high dimensional stability and abrasion resistance. Bonds well to metals, glass, ceramics and most plastics. Serviceable from -60°F to +350°F.

Nanosilica Filled, UV Dual Cure System UV22DC80ND

Dual cure system with UV and heat curing mechanisms. Fast cures at 80°C in shadowed out areas. Nano filled, high dimensional stability and abrasion resistance. Bonds well to metals, glass, ceramics and most plastics. Minimal shrinkage upon curing. Serviceable from -60°F to +350°F.

UV22DC80TK One Part, Dual UV and Heat Curing System UV22DC80TK

Dual cure system with UV and heat curing mechanisms. Fast cures at 80°C in shadowed out areas. Nano filled, high dimensional stability and abrasion resistance. Bonds well to metals, glass, ceramics and most plastics. Minimal shrinkage upon curing. Serviceable from -60°F to +350°F.

One Part, Dual Curing Adhesive UV23FLDC-80TK UV23FLDC-80TK

UV and heat curable epoxy formulation. Cures in "shadowed out" areas at temperatures as low as 80°C. Convenient no mix system. Serviceable from -80°F to +300°F. Superb electrical insulator.

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