Flexible Adhesives and Sealants for Thermal Management

Master Bond offers various flexible curing epoxies and silicones, which can be used as adhesives, sealants, and gap filling compounds. These compliant, soft, stress absorbing compounds contain special thermal conductive fillers and offer low thermal resistance with good heat dissipation. They can be used to fill gaps between heat generating electronic components, printed circuit boards and heat sinks. These products are designed to improve reliability, performance, and longevity of electronic devices by dissipating heat. Systems are engineered to flow effectively into small gaps and can be used to protect against vibration, impact, shock, and moisture. Select grades are available in different viscosities, shore hardness, and cure times. Many can be dispensed automatically for high volume production operations.

These products are frequently employed as an alternative to thermal gap pads. They cure in place and induce low stress on components during the manufacturing process. In comparison to single thickness/shaped, sized gap pads, Master Bond flexible epoxies and silicones perform well on uneven surfaces. Since viscosity and cured hardness can be adjusted, such compounds can easily accommodate design changes expeditiously. This will reduce lead times for any revisions and eliminate the need for multiple pad part sizes. Additionally, this will abolish the waste associated with material yield issues from die cutting sheets. Not only do such compounds optimize productivity with appropriate dispensing equipment but are recommended over gap pads for rapid speed production operations.

Many Master Bond thermally conductive, flexible epoxies and silicones are noted for their high elongation, low modulus, low shrinkage and low exotherm during the curing process, and ability to withstand aggressive thermal cycling. These low/moderate viscosity systems have good flow, convenient mix ratios, cure at room temperature or more rapidly at elevated temperatures. They exhibit protection against corrosion and offer excellent electrical insulation properties.

Master Bond has developed many flexible curing, thermally conductive, gap filling adhesives and sealants for the aerospace, telecommunications, medical, computer, lighting, defense, and electronic industries.